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Automatic Joining Equipment Product List

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Glass Microchip Automatic Bonding Device SiMJ200

Glass Microchip Automatic Bonding Device SiMJ200

It is a light scanning type glass microchip automatic bonding system.

This device is an optical scanning glass microchip automatic bonding system. It achieves a significant reduction in bonding time, which was difficult with conventional methods, by selectively scanning and bonding only the areas that require bonding, such as flow paths, using a programmed pattern bonding software. Furthermore, it is also capable of bonding electrode-embedded microfluidic chips, allowing for easy production of functional microchips at your fingertips.

  • Other process controls
  • Automatic Joining Equipment

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SPR Self-Piercing Riveting System

SPR Self-Piercing Riveting System

Long lifespan, high precision, high quality

Product Features: ■ High rivet joint strength ■ Simple process, work completed in one step (crimping 1-2 seconds) ■ Data collection and analysis possible through servo drive ■ Various supply methods (tape, vibrating bowl) meet the practical work needs of users ■ Crimping force: up to 85kN Main Applications: ■ Riveting of multi-layer materials for hoods ■ Riveting of multi-layer aluminum door frames Features of the Rivet Setter: - Servo rivet technology - Maximum fastening force: 85kN - Cycle time: 2-3 seconds, significantly reduced takt time - Easy maintenance due to modularization of components

  • Other process controls
  • Automatic Joining Equipment

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